The Consortium reaches major milestone on the project as wafer processing concludes

The Consortium has reached a major development milestone with the successful delivery of the first processed wafers, marking the completion of front-end manufacturing for the innovative SCOPS power management ASIC. Produced at the French Corbeil-Essonnes fabrication facility of X-FAB, the wafers were manufactured using a Multi-Layer Mask set, ensuring flexibility and efficiency during the development cycle.

This achievement confirms the nominal progress of the activity and the maturity of the manufacturing process. With wafer processing now finalized, the project transitions into the next critical stages of dicing, packaging, and assembly.

SCOPS is a next-generation, radiation-hardened controller ASIC designed to manage high-current, low-voltage DC-DC converters in advanced satellite platforms. The device enables decentralized, fault-tolerant control of multi-phase DC-DC converters, supporting parallel operation of up to ten power stages at high switching frequency.

The completion of wafer fabrication represents a decisive step toward full system validation. Moving forward, the project advances toward assembly to support silicon validation through electrical tests, ESD tests, life tests, and radiation evaluation.

These upcoming activities will validate the silicon's performance and confirm its radiation hardness, paving the way for the SCOPS ASIC to demonstrate its capabilities in representative space environments and reach TRL7.