Synergie CAD participates in the IMAPS Europe 2024 and shows SCOPS

Synergie CAD was present at the IMAPS-MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum”, which was held in Grenoble (France), at the WTC Congress Center from June 19-20, 2024.

This conference’s objective is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community.

Synergie CAD proudly showcased its innovative packaging and testing capabilities, firmly rooted in the "made in France" ethos. This event provided a valuable platform for engaging in meaningful discussions about the SCOPS package within the EU semiconductor industry. By highlighting SCOPS, the company aimed to foster partnerships and promote the integration of this advanced packaging solution across various sectors.